Udemy - Microelectromechanical Systems III - Fabrication Fundamen...

Files:

• Get Bonus Downloads Here.url (0.2 KB)
~Get Your Files Here ! 1 - Introduction
• 1. Introduction.en_US.srt (15.2 KB)
• 1. Introduction.mp4 (152.5 MB)
• 2. Course Structure & Syllabus.en_US.srt (9.2 KB)
• 2. Course Structure & Syllabus.mp4 (40.5 MB)
• 3. Specialization Options.en_US.srt (4.1 KB)
• 3. Specialization Options.mp4 (35.2 MB)
2 - MEMS Materials and Process Landscape
• 4. MEMS Fabrication Categories.en_US.srt (14.4 KB)
• 4. MEMS Fabrication Categories.mp4 (152.3 MB)
• 5. Silicon Polymers Ceramics and Carbon MEMS.en_US.srt (10.6 KB)
• 5. Silicon Polymers Ceramics and Carbon MEMS.mp4 (135.9 MB)
• 6. Bulk vs Surface Micromachining Overview.en_US.srt (12.8 KB)
• 6. Bulk vs Surface Micromachining Overview.mp4 (127.7 MB)
• 7. What MUMPs Is and Why It Exists.en_US.srt (4.9 KB)
• 7. What MUMPs Is and Why It Exists.mp4 (47.6 MB)
3 - Core Microfabrication Processes
• 10. Oxidation and the Deal–Grove Model.en_US.srt (5.7 KB)
• 10. Oxidation and the Deal–Grove Model.mp4 (43.2 MB)
• 11. Doping Diffusion vs Ion Implantation.en_US.srt (4.8 KB)
• 11. Doping Diffusion vs Ion Implantation.mp4 (50.2 MB)
• 12. Wet vs Dry Etching (Isotropic vs Anisotropic).en_US.srt (6.3 KB)
• 12. Wet vs Dry Etching (Isotropic vs Anisotropic).mp4 (53.1 MB)
• 8. Photolithography (Positive vs Negative).en_US.srt (8.9 KB)
• 8. Photolithography (Positive vs Negative).mp4 (59.3 MB)
• 9. Thin Film Deposition (CVD PVD Electroplating).en_US.srt (9.8 KB)
• 9. Thin Film Deposition (CVD PVD Electroplating).mp4 (103.0 MB)
4 - Micromachining Strategies
• 13. Bulk Micromachining Techniques.en_US.srt (7.3 KB)
• 13. Bulk Micromachining Techniques.mp4 (48.4 MB)
• 14. Surface Micromachining Flow.en_US.srt (6.5 KB)
• 14. Surface Micromachining Flow.mp4 (34.5 MB)
• 15. Sacrificial Layers and Release.en_US.srt (7.4 KB)
• 15. Sacrificial Layers and Release.mp4 (44.6 MB)
• 16. Wafer Bonding Techniques.en_US.srt (7.6 KB)
• 16. Wafer Bonding Techniques.mp4 (68.6 MB)
5 - High Aspect Ratio MEMS
• 17. LIGA Process Fundamentals.en_US.srt (10.2 KB)
• 17. LIGA Process Fundamentals.mp4 (78.7 MB)
• 18. X Ray Lithography and Electroforming.en_US.srt (8.5 KB)
• 18. X Ray Lithography and Electroforming.mp4 (94.6 MB)
• 19. UV LIGA (SU 8) and Trade Offs.en_US.srt (4.5 KB)
• 19. UV LIGA (SU 8) and Trade Offs.mp4 (22.2 MB)
• 20. Applications of High Aspect Ratio MEMS.en_US.srt (4.7 KB)
• 20. Applications of High Aspect Ratio MEMS.mp4 (34.2 MB)
6 - Packaging Testing and Reality
• 21. Why Packaging Dominates MEMS Cost.en_US.srt (8.1 KB)
• 21. Why Packaging Dominates MEMS Cost.mp4 (59.5 MB)
• 22. Wafer Level vs Die Level Packaging.en_US.srt (3.9 KB)
• 22. Wafer Level vs Die Level Packaging.mp4 (36.5 MB)
• 23. Wire Bonding vs Flip Chip.en_US.srt (5.0 KB)
• 23. Wire Bonding vs Flip Chip.mp4 (31.9 MB)
• 24. Testing MEMS Devices (Pressure Acceleration Fluids).en_US.srt (5.8 KB)
• 24. Testing MEMS Devices (Pressure Acceleration Fluids).mp4 (59.6 MB)
• 25. Reliability Yield and Industrial Constraints.en_US.srt (7.3 KB)
• 25. Reliability Yield and Industrial Constraints.mp4 (78.7 MB)
7 - Closing
• 1. Final Assessment.html (10.1 KB)
• 26. Closing.en_US.srt (3.8 KB)
• 26. Closing.mp4 (11.0 MB)
• Bonus Resources.txt (0.1 KB)